Performing Comprehensive Wafer Inspection with Non-Contact 3D Optical Profiling

 

Introduction

As consumer electronics component sizes continue to decrease, there is a corresponding need for precise wafer metrology to refine and control the manufacturing of these complicated devices. 

This application note provides an in-depth introduction to various types of analysis performed with 3D optical profiling technology which improves the manufacture and performance of wafers.

Measurement Advantages of White Light Interferometry

3D optical profiling provides many advantages over other measurement techniques for non-contact inspection of semiconductor packaging front-end process research and control. These advantages range from fully-automated measurements and non-destructive inspection to custom analyses and fast measurement speeds.

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